ADT dicing blades

ADT.ADT specializes in developing semiconductor wafer dicing, chip packaging component cutting, and hard microelectronic component (MEC) cutting systems and processes, as well as blade manufacturing. ADT offers cutting equipment with extensive functionality, diverse configurations, and flexible automation levels. Additionally, it provides peripheral equipment and consumables to meet growing customer demands. Leveraging extensive expertise in equipment, blades, and process technologies, the company delivers comprehensive dicing solutions. Key products include: dicing machines, dicing blades, peripheral equipment, and dicing accessories.