CEE.CEE was established in 2000 to provide customers with one-stop PCB solutions. Specializing in the R&D, production, and sales of rigid multilayer boards (MLB), high-density interconnect (HDI) boards, flexible circuits and assemblies (FPC & FPCA), and rigid-flex boards (R-F), CEE is a key national Torch Program high-tech enterprise. CEE closely follows market changes, continuously optimizes its industrial structure, and actively expands into the high-end PCB market. Through years of development, leveraging extensive industry experience, advanced technological capabilities, and an efficient, innovative management team, CEE has established a modern integrated management system encompassing R&D, production, sales, and service. Its products are widely applied in consumer electronics, network communications, automotive electronics, new display technologies, security and industrial control, healthcare, and emerging fields such as artificial intelligence, big data and cloud computing, the Internet of Things, biometrics, smart wearables, smart home devices, and drones. Key products include: Rigid Multilayer Boards (MLB), High-Density Interconnect Boards (HDI), Flexible Printed Circuits and Assemblies (FPC & FPCA), and Rigid-Flex Boards (R-F).
