2026-07-28 16:06:53
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The integration of China's insulator industry with 5G has extended from traditional power support structures to high-frequency communication core components, forming a new industrial synergy driven by material performance innovation. The 5G millimeter wave frequency band (above 24GHz) puts forward the core requirements of 'three lows and one high' for insulation materials: the dielectric constant (Dk) should be stable between 3.0-3.5, the dielectric loss (Df) should be ≤ 0.003, the thermal expansion coefficient should match the copper foil (≤ 15 ppm/℃), and it should have a thermal conductivity of ≥ 1.0 W/(m · K). Mainstream materials include PTFE ceramic composite materials (such as Wangling F4BTMS series), modified polyphenylene ether (XYRON) ™)、 Polyetherimide (PEI) and high-purity PPS, among which PEI has a Df ≤ 0.0015 and a Tg of 217 ℃ at 1GHz, are widely used in 5G RF module substrates and antenna covers. Domestic enterprises are accelerating the substitution of domestic products. Guangxin Technology and other companies have achieved the application of low adhesive mica tape VPI technology in communication insulation parts, while 3M boron nitride filler and Asahi Kasei XYRON ™ International solutions such as resin still dominate the high-end market. The function of insulators has expanded from single electrical isolation to signal integrity assurance, and is applied to key structures such as base station antenna brackets, high-frequency PCB copper-clad laminates, millimeter wave antenna covers, etc., supporting the high-density deployment and thermal management requirements of 5G base stations. The current bottleneck is that high-purity raw materials (such as hexagonal boron nitride) and precision molding equipment still rely on imports, and domestic materials still have a gap in high-frequency stability and long-term weather resistance.