DIASC diamond wire

DIASC.DIASC was established on January 29, 1999, and is registered in Jiangning District, Nanjing. The company occupies a total land area of 240 mu, with a total floor area of approximately 145,000 square meters. The company is a high-tech enterprise specializing in the R&D, production, and sales of diamond and cubic boron nitride (CBN) tools. It has developed two complementary product lines: diamond grinding wheels and diamond wire, which are primarily used for precision cutting, grinding, and polishing of hard and brittle materials such as silicon, sapphire, quartz, ferrite, neodymium-iron-boron, ceramics, glass, and cemented carbide. Since its establishment, the company has consistently adhered to the development philosophy of “people-oriented, technology-first.” It has recruited numerous foreign experts and established a specialized R&D institute in Japan dedicated to superhard material tools. After years of research and development, DIASC has become one of the earliest domestic enterprises to independently master diamond wire manufacturing technology and successfully achieve industrialization, thereby breaking the technological monopoly held by foreign companies. The company’s recently developed products—including wafer back-thinning grinding wheels, wafer chamfering grinding wheels, and PAD dressers—provide high-quality diamond tools for the semiconductor and solar photovoltaic industries. With their excellent product quality and cost-effectiveness, these products have earned the recognition of numerous leading customers, establishing significant influence within the domestic industry.