DIASC

DIASC.

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DIASC.DIASC is a high-tech enterprise established in 1999 and headquartered in Nanjing. The company specializes in the R&D, production, and sales of diamond and cubic boron nitride tools, with core products including diamond grinding wheels and diamond wire. Its products are widely used in industries such as semiconductors and solar photovoltaics for precision cutting, grinding, and polishing of hard and brittle materials like silicon and sapphire. Since its inception, the company has prioritized technological advancement. By establishing a research and development facility in Japan, it successfully broke through foreign technological monopolies, becoming one of China's first enterprises to achieve industrial-scale production of diamond wire. Through high-quality, cost-effective products—such as silicon wafer backside thinning grinding wheels—the company has earned widespread recognition within the industry and established significant market influence.

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Product Detail

DIASC.DIASC is a high-tech enterprise established in 1999 and headquartered in Nanjing. The company specializes in the R&D, production, and sales of diamond and cubic boron nitride tools, with core products including diamond grinding wheels and diamond wire. Its products are widely used in industries such as semiconductors and solar photovoltaics for precision cutting, grinding, and polishing of hard and brittle materials like silicon and sapphire. Since its inception, the company has prioritized technological advancement. By establishing a research and development facility in Japan, it successfully broke through foreign technological monopolies, becoming one of China's first enterprises to achieve industrial-scale production of diamond wire. Through high-quality, cost-effective products—such as silicon wafer backside thinning grinding wheels—the company has earned widespread recognition within the industry and established significant market influence.

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