DIASC.DIASC was established on January 29, 1999, with its registered location in Jiangning District, Nanjing. The company occupies a total area of 240 mu (approximately 16 hectares) and has a building area of about 145,000 square meters. As a high-tech enterprise specializing in the R&D, production, and sales of diamond and cubic boron nitride tools, it currently offers two complementary product lines: diamond grinding wheels and diamond wire. These products are used for precision cutting, grinding, and polishing of hard and brittle materials such as silicon, sapphire, quartz, ferrite, neodymium iron boron, ceramics, glass, cemented carbide, and other hard and brittle materials. Since its inception, the company has consistently adhered to a “people-oriented, technology-first” development philosophy. It has recruited multiple foreign experts and established a specialized R&D institute for superhard material tools in Japan. After years of research, the company became one of China's earliest enterprises to independently master diamond wire manufacturing technology and successfully achieve industrialization. This breakthrough shattered foreign technological monopolies. Alongside newly developed products like silicon wafer backside thinning grinding wheels, silicon wafer chamfering grinding wheels, and PAD dressers, providing premium diamond tools for the semiconductor and solar photovoltaic industries. With its excellent quality and high cost-effectiveness, the company has earned recognition from numerous influential users and established significant industry influence domestically. Key products include: electroplated diamond wire, precision tools for the semiconductor industry, grinding wheels for precision cutting tools, semiconductor manufacturing equipment, precision tools for traditional industries, and high-efficiency eco-friendly cutting fluids.
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