DYNAX chip design

DYNAX.

DYNAX chip design

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DYNAX.DYNAX, established in 2011, is a leading domestic provider of RF gallium nitride (GaN) manufacturing services. It pioneered the R&D and large-scale commercialization of GaN RF chips and power amplifier devices in China, delivering high-efficiency semiconductor products and solutions for RF applications including 5G mobile communication base stations and wideband communications. DYNAX maintains a comprehensive RF product portfolio covering telecom infrastructure, RF power, and diverse general-purpose applications. The company has established a series-based product platform spanning from GaN die to GaN power transistors, addressing customers' multifaceted application requirements. Through independent R&D, DYNAX has established a comprehensive GaN RF chip technology system encompassing epitaxial growth, chip design, wafer fabrication, packaging/testing, and reliability. By the end of 2024, the company held 544 GaN-related patents globally (including 144 overseas invention patents) and accumulated over 2,000 process recipes. The company possesses core competitiveness across multiple dimensions, including GaN chip technology, mass production capabilities, and stable operations. DYNAX is committed to comprehensive customer satisfaction and continuous improvement in product quality. Based on ISO9001, it has established a complete quality management system covering the entire product realization process. From product design and development, through production, to final factory inspection, each process undergoes strict standard control to ensure product reliability and consistency. Primary products include: ceramic-encapsulated discrete power amplifier tubes, plastic-encapsulated discrete power amplifier tubes, integrated multi-chip modules, H-series tube core products, and J-series tube core products.

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Product Detail

DYNAX.DYNAX, established in 2011, is a leading domestic provider of RF gallium nitride (GaN) manufacturing services. It pioneered the R&D and large-scale commercialization of GaN RF chips and power amplifier devices in China, delivering high-efficiency semiconductor products and solutions for RF applications including 5G mobile communication base stations and wideband communications. DYNAX maintains a comprehensive RF product portfolio covering telecom infrastructure, RF power, and diverse general-purpose applications. The company has established a series-based product platform spanning from GaN die to GaN power transistors, addressing customers' multifaceted application requirements. Through independent R&D, DYNAX has established a comprehensive GaN RF chip technology system encompassing epitaxial growth, chip design, wafer fabrication, packaging/testing, and reliability. By the end of 2024, the company held 544 GaN-related patents globally (including 144 overseas invention patents) and accumulated over 2,000 process recipes. The company possesses core competitiveness across multiple dimensions, including GaN chip technology, mass production capabilities, and stable operations. DYNAX is committed to comprehensive customer satisfaction and continuous improvement in product quality. Based on ISO9001, it has established a complete quality management system covering the entire product realization process. From product design and development, through production, to final factory inspection, each process undergoes strict standard control to ensure product reliability and consistency. Primary products include: ceramic-encapsulated discrete power amplifier tubes, plastic-encapsulated discrete power amplifier tubes, integrated multi-chip modules, H-series tube core products, and J-series tube core products.

DYNAX chip design
DYNAX.
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DYNAX chip design

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