FHEC.FHEC was established in November 2017, specializing in the development of integrated circuit packaging and testing solutions, as well as the packaging processing and testing of various types of integrated circuit chips. As a high-tech enterprise dedicated to IC packaging and testing, FHEC prioritizes new technology development and emphasizes R&D investment. The core team members possess extensive industry experience, having worked at leading domestic and international packaging and testing enterprises. The factory is equipped with comprehensive IT systems and automated production capabilities. The company boasts an excellent product portfolio and has successfully entered the supply chains of renowned domestic and international design companies. Key products include: Bumping & WLP Packaging, BGA Packaging, QFN/QFP Leadframe Packaging, Flipchip, and SiP System-in-Package.