FHEC chip

FHEC.Founded in November 2017, FHEC is a high-tech enterprise specializing in the development of integrated circuit packaging and testing solutions, as well as various chip packaging processing and testing services. The company emphasizes technological innovation and R&D investment, with core team members hailing from leading domestic and international packaging and testing enterprises, possessing extensive industry experience. The factory operates with comprehensive IT systems and advanced production automation capabilities, featuring an optimized product portfolio that has successfully secured supply chain partnerships with multiple renowned domestic and international chip design companies. Its core packaging technologies encompass Bumping & WLP, BGA, QFN/QFP leadframe packaging, Flipchip, and SiP system-level packaging, committed to delivering professional packaging and testing solutions to clients.