GAOCE semiconductor

GAOCE.GAOCE was established on October 20, 2006, and is headquartered in Qingdao, Shandong Province. The company specializes in the research, development, production, sales, and support services for cutting equipment and consumables designed for hard and brittle materials. Leveraging its proprietary core technologies, GAOCE provides integrated system solutions for the photovoltaic industry, covering the entire process from ingot to wafer—including “trimming, squaring, grinding, polishing, and slicing.” Currently, all of the world’s top ten photovoltaic wafer manufacturers are GAOCE’s clients. The company is actively expanding its diamond wire cutting technology into the processing of high-hardness, brittle materials such as semiconductor silicon, silicon carbide, sapphire, and magnetic materials. Its related R&D and industrial applications have been recognized and adopted by leading enterprises in the industry. At the same time, GAOCE has seized opportunities in the wafer foundry market and rapidly expanded its wafer cutting and processing services. GAOCE is committed to driving development through technological innovation, dedicated to continuously creating value for customers, promoting cost reduction and efficiency gains in the industry, and contributing to the achievement of “carbon neutrality” goals. The company’s main products include cutting equipment and consumables for the photovoltaic, semiconductor, silicon carbide, sapphire, and magnetic materials sectors, as well as silicon wafer products.