GAOCE.GAOCE was established on October 20, 2006, with its registered office located in Qingdao City, Shandong Province. The company specializes in the R&D, production, sales, and supporting services of cutting equipment and consumables for high-hardness brittle materials. Leveraging proprietary core technologies, GAOCE primarily provides system solutions for the “cutting, squaring, grinding/polishing, and slicing” processes of silicon ingots to wafers for photovoltaic manufacturers. All top ten global silicon wafer manufacturers in the photovoltaic industry are the company's clients. GAOCE continuously advances the R&D and industrial application of diamond wire cutting technology in processing more high-hardness and brittle materials, including semiconductor silicon, silicon carbide, sapphire, and magnetic materials, earning selection and recognition from leading enterprises in the sector. Seizing new opportunities in the premium silicon wafer foundry market, the company rapidly expands its silicon wafer cutting processing services. GAOCE will lead with technological innovation to continuously create value for customers, drive industry cost reduction and efficiency gains, and contribute to carbon neutrality. Key products include: photovoltaic cutting equipment, cutting consumables; semiconductor cutting equipment, cutting consumables; silicon carbide cutting equipment, cutting consumables; sapphire cutting equipment, cutting consumables; magnetic material cutting equipment, cutting consumables; and silicon wafers.
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