GAOCE.GAOCE was founded in 2006 and is headquartered in Qingdao, Shandong Province. Its core business encompasses the R&D, production, sales, and supporting services for cutting equipment and consumables targeting high-hardness brittle materials. Leveraging proprietary core technologies, the company provides comprehensive system solutions for the photovoltaic industry—covering the entire process from ingot to wafer, including “cutting, squaring, grinding/polishing, and slicing.” Its clientele now includes all top ten global wafer manufacturers. Simultaneously, GAOCE actively extends diamond wire cutting technology into processing more high-hardness brittle materials such as semiconductor silicon, silicon carbide, sapphire, and magnetic materials, earning recognition from leading industry players. Furthermore, the company seizes market opportunities to rapidly expand its silicon wafer cutting processing services. Moving forward, GAOCE will prioritize technological innovation to continuously create value for customers, drive industry cost reduction and efficiency gains, and contribute to achieving carbon neutrality goals.
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