HANSATT.HANSATT was established in September 2007 as a national high-tech enterprise specializing in the R&D, production, and sales of semiconductor and semiconductor-related packaging and testing equipment. As China's first domestic enterprise to fully master core wire bonding machine technologies, the company's “HANS” series products—including high-speed, high-precision fully automatic planar wire bonding machines, high-speed fully automatic through-hole wire bonding machines, fully automatic die attach wire bonding production lines, high-speed SMD sorting machines, and high-speed SMD tape feeders—have solidified their leading position in the domestic equipment market after over a decade of optimization and refinement. Within the semiconductor packaging and testing equipment sector, the company's products have achieved internationally advanced levels in key R&D technical indicators, earning widespread industry recognition. Upholding a “quality first” philosophy, the company continuously enhances its quality management systems, holding ISO9001 Quality Management System Certification, ISO14001 Environmental Management System Certification, and Intellectual Property Compliance Management System Certification to ensure sustained compliance with high standards for products and services. The company also participates in drafting national integrated circuit standards, ensuring these standards align with industry practices and technological advancements to safeguard the quality and competitiveness of its products and services. Key products include: high-speed fully automatic planar wire bonding machines, high-speed fully automatic through-hole wire bonding machines, test sorting machines, high-speed semiconductor tape-and-reel machines, high-speed planar die attach machines, fully automatic die attach and wire bonding production lines, and integrated test and tape-and-reel machines.
