MTM Encapsulation

MTM.MTM was established in October 2020 and is headquartered in Zhuzhou, Hunan. As a high-tech enterprise with internationally leading advanced packaging technology, the company provides services including packaging design, multi-physics simulation, and one-stop SiP advanced packaging mass production. Its products are applied across multiple fields such as computing power, BeiDou navigation, automotive electronics, industrial control, power management, biomedicine, and IoT, having established strong partnerships with over 200 clients. With over 51,000 square meters of production facilities, the company has established multiple packaging product lines including Chiplet, SiP, CSP, LGA/BGA, QFN/DFN, and fcBGA. Leveraging robust delivery capabilities and reliable product quality, MTM is committed to creating value for customers through innovative technology and high-quality services, driving progress in the packaging industry.