TGVTECH.TGVTECH was established in June 2022 and is registered in Tianmen, Hubei. As a high-tech enterprise, it specializes in the R&D and manufacturing of glass-based TGV (Through Glass Via) multilayer precision circuit boards and related packaging technologies. Its products hold broad application prospects in fields such as semiconductor 2.5D/3D chiplet advanced packaging, high-performance computing, MEMS sensing, 6G/low-orbit satellite communication RF devices, and optical communication CPO co-packaging. The company stands as one of the world's earliest enterprises to achieve industrial-scale production of TGV glass-based multilayer circuit boards. It is also among the globally scarce companies possessing comprehensive process and equipment capabilities spanning the entire manufacturing chain—from glass thinning, via formation, via filling, metallization, to multilayer circuit fabrication. Leveraging its integrated full-industry-chain technological strengths, GVTECH has partnered with multiple renowned domestic and international clients and entered mass production, striving to become a world-leading innovator in this field. Key products include glass-based chip packaging substrates, CPO applications and RF devices, light-emitting chip packaging substrates, and microfluidic devices.
