XIAMEN COMPASS

XIAMEN COMPASS.XIAMEN COMPASS was established on May 30, 2018, with a registered capital of RMB 561,002,920. The XIAMEN COMPASS project introduces high-density, ultra-fine (minimum line width/spacing 4μm/4μm, minimum aperture 10μm) and multilayer flexible substrate technology. Positioned for medical imaging modules, optical communication modules, OLED driver chip COF, industrial applications, wearables, and other high-density flexible substrate packaging solutions, the company provides customers with one-stop services encompassing flexible substrate design, processing, manufacturing, and packaging assembly. XIAMEN COMPASS is committed to becoming a world-class leader in high-density IC packaging and interconnect solutions, filling the domestic gap in high-density flexible substrates and achieving domestic production and self-reliance for critical COF packaging substrates. Key product applications include: medical diagnostics/imaging, optoelectronics (fiber optics), industrial applications, and wearable devices.

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