ACCESS modules

ACCESS.ACCESS was established on April 26, 2006, and is located in the Fushan Industrial Zone, Doumen District, Zhuhai City, Guangdong Province, with a factory floor area of 40,000 square meters. The company is one of the earliest enterprises in mainland China to engage in the R&D and industrialization of packaging substrates, and it was also the first in the packaging materials sector to achieve the industrialization of embedded packaging technology. Through continuous independent innovation, ACCESS has kept pace with the evolution of semiconductor packaging technology and changes in downstream market demand. Its main products have continuously upgraded along the path of “IC packaging substrates—embedded packaging modules,” expanding from packaging substrates to system-level packaging modules. Its application areas have gradually expanded from RF front-end to markets such as power management and digital chips, with an increasingly diverse product portfolio. The company has now grown into a key supplier of packaging materials in the advanced semiconductor packaging sector. Its main products include: RF module packaging substrates, ASIC chip packaging substrates, power management chip packaging substrates, FCBGA packaging substrates, and embedded packaging substrates/modules.