ACM electroplating equipment

ACM.Founded in 2005 and headquartered in Pudong New Area, Shanghai, ACM is an integrated enterprise engaged in R&D, design, manufacturing, and sales, dedicated to providing high-end semiconductor equipment to customers worldwide. Its main products include single-wafer and tank-type wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, front-end coating and developing equipment, and PECVD equipment. Adhering to a strategy of differentiated competition and innovative development, the company leverages its proprietary technologies—including single-wafer ultrasonic cleaning, single-wafer tank-type combined cleaning, electroplating, stress-free polishing, and vertical furnace tube technologies—to provide customized equipment and process solutions for customers in global wafer manufacturing, advanced packaging, and other sectors. These solutions effectively help customers enhance production efficiency, improve product yield, and reduce production costs.