ACCESS.ACCESS was established on April 26, 2006, and is located in the Fushan Industrial Zone, Doumen District, Zhuhai City, Guangdong Province, with a factory area of 40,000 square meters. ACCESS is one of the earliest enterprises in mainland China to engage in the R&D and industrialization of packaging substrates, and it was also the first company in mainland China to achieve the industrialization of embedded packaging technology in the field of packaging materials. Through continuous independent innovation, keeping pace with semiconductor packaging technology iterations and evolving downstream market demands, its core products have upgraded along the “IC packaging substrate → embedded packaging module” trajectory. This progression spans from packaging substrates to system-level packaging modules, with application domains expanding from RF front-end to power management, digital chips, and other markets. The company has continuously diversified its product portfolio, establishing itself as a key semiconductor packaging materials provider in the advanced packaging sector. Its core offerings include: RF module packaging substrates, ASIC chip packaging substrates, power management chip packaging substrates, FCBGA packaging substrates, and embedded packaging substrates/modules.
