ACM electroplating

ACM.ACM was established in 2005 and is registered in Shanghai's Pudong New Area. As an integrated R&D, design, manufacturing, and sales enterprise, ACM provides high-end semiconductor equipment to global customers. Its primary products include single-wafer and tray wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, front-end coating and developing equipment, and PECVD equipment. ACM adheres to a strategy of differentiated competition and innovation. Through proprietary technologies including single-wafer ultrasonic cleaning, single-wafer tray combination cleaning, electroplating, stress-free polishing, and vertical furnace tube processing, ACM delivers customized equipment and process solutions to global wafer manufacturers, advanced packaging firms, and other clients. These solutions effectively enhance production efficiency, improve product yield rates, and reduce manufacturing costs. Key products include: single-wafer and tray wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, front-end coating and developing equipment, and PECVD equipment.