2026-04-02 21:16:34
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The Chinese copper-clad laminate industry has achieved a structural leap under the empowerment of 5G, driven by the upgrading of communication infrastructure and the demand for high-frequency terminal equipment. The evolution of 5G base stations towards AAU integrated architecture has increased the usage of single station PCBs by more than three times, promoting the accelerated replacement of high-frequency copper-clad laminates from traditional FR-4 to low dielectric constant (Dk<3.5) and low dielectric loss (Df<0.002) materials such as PTFE and MPI. By 2025, the market size of China's high-frequency and high-speed copper-clad laminates will reach 37.06 billion yuan, with a compound annual growth rate of 25%. Leading enterprise Shengyi Technology has achieved a breakthrough in domestic production by introducing PTFE technology. By 2025, the proportion of high value-added products will significantly increase, and after the second phase of the Jiangxi base is put into operation, an additional annual production capacity of 18 million square meters will be added; The revenue of South Asia New Materials' high-speed products is expected to double, and the products have been widely used in 5G base station antennas, millimeter wave radars, and 800G optical modules. Downstream demand is exploding synchronously, driven by emerging scenarios such as AI servers, intelligent automotive radar, and LCP flexible antennas, driving the demand for high-end copper-clad laminates. By 2025, the total number of 5G base stations in China will reach 4.838 million, with an average consumption of 200 square meters of high-frequency substrates per base station, driving the industry from 'scale competition' to 'technology barrier' competition. Driven by both material innovation and capacity expansion, China has accounted for over 70% of global copper-clad laminate production, becoming a core supplier of high-frequency and high-speed materials worldwide.